What is a flip chip used for?

Flip chip process is used for packaging a broad range of electronics which include Integrated circuits, infrared sensors, large area pixelated detector arrays, optical devices, MEMS and surface acoustic wave (SAW) devices.

What is the main advantage of a flip chip package?

Flip chip bonding can offer a number of advantages over other interconnection processes. Flip chip bonding can provide higher I/O count as the whole area of the die can be used for connections. Due to the short interconnections paths, compared to wire bonds, the speed of a device can be improved.

What is a flip chip package?

Flip chip describes the method of electrically connecting the die to the package carrier. The package carrier, either substrate or leadframe, then provides the connection from the die to the exterior of the package. In “standard” packaging, the interconnection between the die and the carrier is made using wire.

What is wire bond and flip chip?

Flip-chip assembly and wire bonding are the principal methods for interconnecting ICs. While each offers strong advantages in certain types of applications, packaging is continuing to evolve into a segmented marketplace, with several factors dictating the most appropriate means of interconnection.

Is flip chip wafer level packaging?

At Maxim®/Dallas Semiconductor, the terms “flip chip” and “chip-scale package” were initially used synonymously for all types of wafer-level packaged dies. Over the years, further distinction developed for the packages.

How are flip chips made?

Process steps Pads are metallized on the surface of the chips. Chips are cut. Chips are flipped and positioned so that the solder balls are facing the connectors on the external circuitry. Solder balls are then remelted (typically using hot air reflow).

What is flip chip LGA?

FC-LGAx package type FC (Flip Chip) means that the processor die is on top of the substrate on the opposite side from the Land contacts. LGA (Land Grid Array) refers to how the processor die is attached to the substrate.

What is WLP in semiconductor?

What is Wafer-Level Packaging? Wafer-level packaging (WLP) is the technology of packaging the die while it is still on the wafer—protective layers and electrical connections are added to the substrate before dicing. Originally, wafers were diced into individual chips, then packaged.

What is Dsbga?

Die Size Ball Grid Array (DSBGA), also known as Wafer Chip Scale Package (WCSP), refers to packaging an IC in wafer form, in contrast to packaging an IC after it has been singulated from the wafer. It uses a copper redistribution layer to connect the silicon interconnect to an array of solder balls.

What is a flip chip resistor?

These chips are built for applications that allow resistors to be mounted on external circuitry by means of solder reflow. Flip-chips allow for SMT to move away from through-hole technology, helping to dramatically increase the PC Board density.

What is TSV in semiconductor?

A through-silicon via (TSV) is a type of via (vertical interconnect access) connection used in microchip engineering and manufacturing that completely passes through a silicon die or wafer to allow for stacking of silicon dice. TSV is an important component for creating 3-D packages and 3-D integrated circuits.